An Active Interferometric Method for Extreme Impedance On-Wafer Device Measurements
Votsi, Haris, Li, C, Aaen, Peter H and Ridler, NM (2017) An Active Interferometric Method for Extreme Impedance On-Wafer Device Measurements IEEE Microwave and Wireless Components Letters., 27 (11). pp. 1034-1036.
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Abstract
Nano-scale devices and high power transistors present extreme impedances, which are far removed from the 50-Ω reference impedance of conventional test equipment, resulting in a reduction in the measurement sensitivity as compared with impedances close to the reference impedance. This letter describes a novel method based on active interferometry to increase the measurement sensitivity of a VNA for measuring such extreme impedances, using only a single coupler. The theory of the method is explained with supporting simulation. An interferometry-based method is demonstrated for the first time with on-wafer measurements, resulting in an improved measurement sensitivity for extreme impedance device characterization of up to 9%.
Item Type: | Article | |||||||||||||||
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Divisions : | Faculty of Engineering and Physical Sciences > Electronic Engineering | |||||||||||||||
Authors : |
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Date : | 27 September 2017 | |||||||||||||||
Funders : | EPSRC | |||||||||||||||
DOI : | 10.1109/LMWC.2017.2750086 | |||||||||||||||
Copyright Disclaimer : | (c) 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works. | |||||||||||||||
Uncontrolled Keywords : | Calibration; Interferometry; Vector network analyser; Eextreme impedance measurement | |||||||||||||||
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Depositing User : | Melanie Hughes | |||||||||||||||
Date Deposited : | 05 Sep 2017 08:58 | |||||||||||||||
Last Modified : | 11 Dec 2018 11:23 | |||||||||||||||
URI: | http://epubs.surrey.ac.uk/id/eprint/842164 |
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