Modeling and simulation of the influence of SOI structure on damage evolution and ultra-shallow junction formed by Ge preamorphization implants and solid phase epitaxial regrowth

Mok, KRC, Colombeau, B, Jaraiz, M, Castrillo, P, Rubio, JE, Pinacho, R, Srinivasan, MP, Benistant, F, Martin-Bragado, I and Hamilton, JJ (2006) Modeling and simulation of the influence of SOI structure on damage evolution and ultra-shallow junction formed by Ge preamorphization implants and solid phase epitaxial regrowth Materials Research Society Symposium Proceedings, 912. pp. 99-104.

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Abstract

Preamorphization implant (PAT) prior to dopant implantation, followed by solid phase epitaxial regrowth (SPER) is of great interest due to its ability to form highly-activated ultrashallow junctions. Coupled with growing interest in the use of silicon-on-insulator (SOI) wafers, modeling and simulating the influence of SOI structure on damage evolution and ultra-shallow junction formation is required. In this work, we use a kinetic Monte Carlo (kMC) simulator to model the different mechanisms involved in the process of ultra-shallow junction formation, including amorphization, recrystallization, defect interaction and evolution, as well as dopant-defect interaction in both bulk silicon and SOI. Simulation results of dopant concentration profiles and dopant activation are in good agreement with experimental data and can provide important insight for optimizing the process in bulk silicon and SOI. © 2006 Materials Research Society.

Item Type:	Article
Divisions :	Surrey research (other units)
Authors :	Name Email ORCID Mok, KRC Colombeau, B Jaraiz, M Castrillo, P Rubio, JE Pinacho, R Srinivasan, MP Benistant, F Martin-Bragado, I Hamilton, JJ j.hamilton@surrey.ac.uk
Date :	21 November 2006
Depositing User :	Symplectic Elements
Date Deposited :	17 May 2017 11:16
Last Modified :	24 Jan 2020 20:35
URI:	http://epubs.surrey.ac.uk/id/eprint/830657

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