MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE
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IEZEKIEL, S, SOSHEA, EA, OKEEFE, MF and SNOWDEN, CM (1995) MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 43 (9). pp. 2421-2427.
Full text not available from this repository.| Item Type: | Article | |||||||||||||||
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| Divisions : | Surrey research (other units) | |||||||||||||||
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| Date : | 1 September 1995 | |||||||||||||||
| DOI : | 10.1109/22.414598 | |||||||||||||||
| Uncontrolled Keywords : | Science & Technology, Technology, Engineering, Electrical & Electronic, Engineering, ENGINEERING, ELECTRICAL & ELECTRONIC, OPTICAL CONNECTIONS, HYBRID INTEGRATION, WAVE-GUIDES, DEVICES | |||||||||||||||
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| Depositing User : | Symplectic Elements | |||||||||||||||
| Date Deposited : | 16 May 2017 12:33 | |||||||||||||||
| Last Modified : | 24 Jan 2020 13:07 | |||||||||||||||
| URI: | http://epubs.surrey.ac.uk/id/eprint/814341 |
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