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Exploring system-on-panel integration for next-generation display applications.

Guo, Xiaojun. (2006) Exploring system-on-panel integration for next-generation display applications. Doctoral thesis, University of Surrey (United Kingdom)..

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Abstract

Following the advent of the digital multi-media era and the popularity of the internet, high-resolution flat-panel displays are becoming the central feature of many consumer products. This dissertation is to explore the challenges and opportunities of system-on-panel (SoP) integration for next-generation high-performance multifunctional flat-panel display products. SoP integration, which aims to mount a display screen and its analogue and digital display driver circuits as well as other high-level function integrated circuits (ICs) on the same glass substrate, will help realize the implementation of high-density, multifunctional, compact display products, and also lead to a substantial savings in costs by shortening the display manufacturing and inspection processes while maintaining a level of high reliability. This dissertation makes contributions on three aspects. Firstly, the dissertation explores the device structure and related design implications for the continuous down-scaling of polycrystalline silicon (poly-Si) thin-film transistors, which is the most promising candidate for building ICs in SoP integration. The thick source/drain nanometre-scale ultra-thin channel poly-Si transistors are demonstrated with desirable performance and ultra-scaling capability in this work. The further analysis by numerical device simulation gives the implications for optimal design of poly-Si TFTs down to sub-100-nm regime. The second contribution is to design and analyze the pixel circuits for the self-emissive type display technologies, i.e. organic light emission diode (OLED) and carbon nanotube (CNT) based field emission displays (FEDs). The merits and related design issues of the switch-current pixel circuits are fully studied. And to integrate the light element devices into SPICE circuit simulations, a simple and effective macro-modelling approach is proposed. Finally, this dissertation also investigates the electro-thermal effects in SoP integration. The analysis results show the much more severe electro-thermal effects in SoP integration compared to that of conventional bulk CMOS and SOI technologies. Possible heating removing and management methods are given for the progress of reliable SoP integration.

Item Type: Thesis (Doctoral)
Divisions : Theses
Authors :
NameEmailORCID
Guo, Xiaojun.UNSPECIFIEDUNSPECIFIED
Date : 2006
Contributors :
ContributionNameEmailORCID
http://www.loc.gov/loc.terms/relators/THSUNSPECIFIEDUNSPECIFIEDUNSPECIFIED
Depositing User : EPrints Services
Date Deposited : 09 Nov 2017 12:12
Last Modified : 09 Nov 2017 14:40
URI: http://epubs.surrey.ac.uk/id/eprint/843043

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