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Effects of Ar and O2 Plasma Etching on Parylene C: Topography versus Surface Chemistry and the Impact on Cell Viability

Kontziampasis, D, Trantidou, T, Regoutz, A, Humphrey, EJ, Carta, Daniela, Terracciano, C and Prodromakis, T (2015) Effects of Ar and O2 Plasma Etching on Parylene C: Topography versus Surface Chemistry and the Impact on Cell Viability Plasma Processes and Polymers, 138. pp. 324-333.

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Abstract

The effect of O2 and Ar plasma etching on poly(chloro‐p‐xylylene) (Parylene C) is thoroughly studied by atomic force microscopy, X‐ray photoelectron spectroscopy, and static contact angle measurements. Results indicate that O2 plasma changes the topography more drastically than Ar plasma. Furthermore, despite the fact that Ar plasma is expected to be chemically inert, both plasmas introduce O2 to the surface of the Parylene C films, while Ar plasma additionally reduces the amount of Cl present in the polymer. The effect on the viability of cultured cardiomyocytes is also examined, indicating that cells attach and survive both on Ar and O2 treated films in contrast to untreated Parylene. These observations can provide useful insight into the field of material science and tissue engineering.

Item Type: Article
Divisions : Faculty of Engineering and Physical Sciences > Chemistry
Authors :
NameEmailORCID
Kontziampasis, D
Trantidou, T
Regoutz, A
Humphrey, EJ
Carta, Danielad.carta@surrey.ac.uk
Terracciano, C
Prodromakis, T
Date : 17 August 2015
Identification Number : 10.1002/ppap.201500053
Uncontrolled Keywords : atomic force microscopy; cell viability; Parylene C; plasma nanoscience; X-ray photoelectron spectroscopy
Depositing User : Jane Hindle
Date Deposited : 04 Sep 2017 13:14
Last Modified : 24 Aug 2018 08:31
URI: http://epubs.surrey.ac.uk/id/eprint/842155

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