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Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications

Pickwell, AJ, Dorey, RA and Mba, D (2011) Thick-Film Acoustic Emission Sensors for Use in Structurally Integrated Condition-Monitoring Applications IEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL, 58 (9). pp. 1994-2000.

Full text not available from this repository.
Item Type: Article
Authors :
NameEmailORCID
Pickwell, AJUNSPECIFIEDUNSPECIFIED
Dorey, RAr.dorey@surrey.ac.ukUNSPECIFIED
Mba, DUNSPECIFIEDUNSPECIFIED
Date : 1 September 2011
Identification Number : 10.1109/TUFFC.2011.2043
Uncontrolled Keywords : Science & Technology, Technology, Acoustics, Engineering, Electrical & Electronic, Engineering, ACOUSTICS, ENGINEERING, ELECTRICAL & ELECTRONIC, PIEZOELECTRIC PROPERTIES
Related URLs :
Depositing User : Symplectic Elements
Date Deposited : 17 May 2017 13:11
Last Modified : 17 May 2017 15:09
URI: http://epubs.surrey.ac.uk/id/eprint/838259

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