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HIGH-SPEED OPTOELECTRONIC MULTICHIP MODULES PACKAGED IN GLASS ON SILICON

IEZEKIEL, S, SOSHEA, EA, OKEEFE, MFJ and SNOWDEN, CM (1994) HIGH-SPEED OPTOELECTRONIC MULTICHIP MODULES PACKAGED IN GLASS ON SILICON In: Conference on Technologies for Optical Fiber Communications, 1994-01-25 - ?, LOS ANGELES, CA.

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Item Type: Conference or Workshop Item (UNSPECIFIED)
Authors :
NameEmailORCID
IEZEKIEL, SUNSPECIFIEDUNSPECIFIED
SOSHEA, EAUNSPECIFIEDUNSPECIFIED
OKEEFE, MFJUNSPECIFIEDUNSPECIFIED
SNOWDEN, CMc.snowden@surrey.ac.ukUNSPECIFIED
Date : 1 January 1994
Identification Number : 10.1117/12.175260
Contributors :
ContributionNameEmailORCID
UNSPECIFIEDBrown, GJUNSPECIFIEDUNSPECIFIED
UNSPECIFIEDDecoster, DJUNSPECIFIEDUNSPECIFIED
UNSPECIFIEDLaCourse, JSUNSPECIFIEDUNSPECIFIED
UNSPECIFIEDPark, YSUNSPECIFIEDUNSPECIFIED
UNSPECIFIEDPedrotti, KDUNSPECIFIEDUNSPECIFIED
UNSPECIFIEDSloan, SRUNSPECIFIEDUNSPECIFIED
publisherSPIE - INT SOC OPTICAL ENGINEERING, UNSPECIFIEDUNSPECIFIED
Uncontrolled Keywords : Science & Technology, Technology, Physical Sciences, Engineering, Electrical & Electronic, Optics, Telecommunications, Engineering
Related URLs :
Depositing User : Symplectic Elements
Date Deposited : 16 May 2017 12:33
Last Modified : 16 May 2017 14:04
URI: http://epubs.surrey.ac.uk/id/eprint/814351

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