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MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE

IEZEKIEL, S, SOSHEA, EA, OKEEFE, MF and SNOWDEN, CM (1995) MICROWAVE PHOTONIC MULTICHIP MODULES PACKAGED ON A GLASS-SILICON SUBSTRATE IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 43 (9). pp. 2421-2427.

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Item Type: Article
Authors :
NameEmailORCID
IEZEKIEL, SUNSPECIFIEDUNSPECIFIED
SOSHEA, EAUNSPECIFIEDUNSPECIFIED
OKEEFE, MFUNSPECIFIEDUNSPECIFIED
SNOWDEN, CMc.snowden@surrey.ac.ukUNSPECIFIED
Date : 1 September 1995
Identification Number : https://doi.org/10.1109/22.414598
Uncontrolled Keywords : Science & Technology, Technology, Engineering, Electrical & Electronic, Engineering, ENGINEERING, ELECTRICAL & ELECTRONIC, OPTICAL CONNECTIONS, HYBRID INTEGRATION, WAVE-GUIDES, DEVICES
Related URLs :
Depositing User : Symplectic Elements
Date Deposited : 16 May 2017 12:33
Last Modified : 16 May 2017 14:04
URI: http://epubs.surrey.ac.uk/id/eprint/814341

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