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Increased feedback due to package mounting

Aaen, PH, Plá, JA and Balanis, CA (2004) Increased feedback due to package mounting IEEE Topical Meeting on Electrical Performance of Electronic Packaging. pp. 49-52.

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Abstract

The affect of the ground step discontinuity created by a difference in package and printed circuit board (PCB) thickness was studied. It is observed that the step in the reference conductor can be represented by a series inductance and its value depends on the height of the step and the width of the transmission line above it. The overall circuit affects for a packaged transistors were simulated with commercially available electromagnetic 2D and 3D CAD tools. The results show that the discontinuity creates an inductive feedback path around the package.

Item Type: Article
Authors :
NameEmailORCID
Aaen, PHUNSPECIFIEDUNSPECIFIED
Plá, JAUNSPECIFIEDUNSPECIFIED
Balanis, CAUNSPECIFIEDUNSPECIFIED
Date : 1 December 2004
Depositing User : Symplectic Elements
Date Deposited : 28 Mar 2017 15:31
Last Modified : 31 Oct 2017 18:28
URI: http://epubs.surrey.ac.uk/id/eprint/811292

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