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Thermal residual stress analysis of epoxy bi-material laminates and bonded joints

Jumbo, FS, Ashcroft, IA, Crocombe, AD and Wahab, MMA (2010) Thermal residual stress analysis of epoxy bi-material laminates and bonded joints INT J ADHES ADHES, 30 (7). pp. 523-538.

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Item Type: Article
Divisions : Faculty of Engineering and Physical Sciences > Mechanical Engineering Sciences
Authors :
AuthorsEmailORCID
Jumbo, FSUNSPECIFIEDUNSPECIFIED
Ashcroft, IAUNSPECIFIEDUNSPECIFIED
Crocombe, ADUNSPECIFIEDUNSPECIFIED
Wahab, MMAUNSPECIFIEDUNSPECIFIED
Date : October 2010
Identification Number : 10.1016/j.ijadhadh.2010.03.009
Uncontrolled Keywords : Epoxy/epoxides, Aluminium alloy, Stress analysis, Thermal residual stress, LOADED BIMATERIAL INTERFACE, ADHESIVE JOINTS, BACKFACE STRAIN, TEMPERATURE, STRENGTH
Additional Information : NOTICE: this is the author’s version of a work that was accepted for publication in NTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in NTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 30(7), October 2010, DOI 10.1016/j.ijadhadh.2010.03.009.
Depositing User : Symplectic Elements
Date Deposited : 01 Aug 2014 14:54
Last Modified : 13 Sep 2014 01:33
URI: http://epubs.surrey.ac.uk/id/eprint/805740

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